100% Made In The USA, the BlackOut Jacket is Amabilis Gear’s latest creation. This fleece jacket combines Polartec Thermal Pro fleece with a patented Hardface treatment which enhances durability and prohibits pilling.
Look for 5 pockets: 3 outside zippered + 2 inside cargo and 2 ea 4 x 4″ Velcro shoulder patches.
Offered in Black, sizes Small – 3XL.
amabilisgear.com/collections/apparel/products/black-out-jacket
January 23, 2023 – The Office of the Under Secretary of Defense for Research and Engineering (OUSD(R&E)) has proposed a prototype project to close the gap between microelectronics innovation and market adoption. The prototype project- Microelectronics Commons – will enable lab-to-fab prototyping– that is, evolve microelectronics laboratory prototyping to fabrication prototyping – in domestic facilities.
Currently, over 85% of microelectronics used in the United States are fabricated outside the U.S. Due to the complexity and market value of today’s integrated microelectronic systems and the lack of adequate on-shore prototyping in which intellectual property (IP) can be protected, there is an urgent need to establish a network of domestic prototyping facilities to demonstrate, at-scale, the system-level benefits of innovations in microelectronics materials, processes, devices, and architectural designs. Demonstrating at-scale commercial viability is the missing requirement to close the gap between laboratory innovations and marketplace adoption. The Department of Defense recognizes the security vulnerabilities of off-shored microelectronics and has made it a top priority to expand our domestic microelectronics infrastructure through the Microelectronics Commons prototype.
“In the face of intense competition globally in the microelectronics landscape, a rapid transition from lab-to-fab is imperative to get ahead of the competition,” stated Dr. Dev Shenoy, Principal Director, Microelectronics, OUSD(R&E) and Director of the Defense Microelectronics Cross Functional Team (DMCFT) during the Microelectronics Commons Industry Days in Washington DC on Dec. 7 – 8. “We want to expedite the lab-to-fab prototyping as well as closely couple the R&D innovation with the manufacturing.”
Microelectronics Commons is a CHIPS and Science Act-funded national network for onshore, microelectronics hardware prototyping, lab-to-fab transition of semiconductor technologies and semiconductor workforce training. The goal of Microelectronics Commons is inaugurating a national network of regional innovation hubs distributed across the U.S. to advance microelectronics prototypes across six critical technology areas. These technology areas are Secure Edge Computing/Internet of Things (IoT), Quantum Technology, 5G/6G Technology, Electromagnetic Warfare, Artificial Intelligence Hardware, and Commercial Leap Ahead Technologies.
“Having regional hubs prioritizing one or more technical areas would facilitate the connections required to nurture and grow regional lab-to-fab capabilities,” stated Doug Crowe, NSTXL’s Strategic & Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) Director, “there is currently a steep drop-off between innovative prototype ideas and the maturation of those technologies that are required to eventually lead to the marketplace.”
Prototyping capabilities for these six technology areas will be supported with initial projects that meet national security and commercial needs. These projects will also serve to partially offset prototyping facility operation and sustainment costs while the hubs fully mature their user-base and execute their access models. One of the goals of Microelectronics Commons is for the technology hubs distributed throughout the regional U.S. become self-sustaining innovation nodes in their core technology areas while leveraging regional strengths to address DoD and commercial needs.
“Fostering the pipeline of microelectronics talent will bolster the microelectronics economies across the U.S.” stated Dr. Shenoy, “the ecosystem that the Microelectronics Commons is going to set up is going to sustain this manufacturing base going forward.”
The Microelectronics Commons is a first-of-its-kind opportunity and is the first major program to erect from the CHIPS and Science Act.
“The Department of Defense is the first agency to move forward with funding from CHIPS,” highlighted Senator Todd Young during his address to industry at the Microelectronics Industry Day event, “[Microelectronics Commons] will maintain and grow our nation’s capabilities to produce the next-generation of semiconductor technology right here at home.”
The Microelectronic Commons Other Transaction Authority (OTA) prototype Request for Solutions (RFS) was released through S²MARTS, managed by NSTXL. To promote this RFS and expand the opportunity to universities, small businesses, and non-traditional defense contractors, S²MARTS consortium led and moderated a Microelectronics Awareness Day that resulted in over 800 industry participants. S²MARTS also hosted Microelectronics Commons Industry Days in Washington D.C. on December 7 – 8, 2022, and is also hosting Capabilities Pitch days for each technology area from January 9-20, 2023. These events encourage all defense contractors, non-traditional defense contractors, small businesses, and universities to participate to showcase their capabilities in one or more of the six technical areas within the RFS.
Speaking during the Microelectronics Commons Industry Days, White House Coordinator for CHIPS Implementation Dr. Ronnie Chatterji said, “We are going to build on the capabilities we already have to reach greater heights.” Encouraging widespread participation in this opportunity, Dr. Chatterji also emphasized “Working together is how we got a man on the moon in 1969 and working together is how we are going to achieve these American dreams on research and development.”
The Microelectronics Commons project is expected to be executed within a 60-month period. All the advancements derived in the six technology areas will be dual-use technology, benefiting the DoD and commercial sectors, as well as create a resilient microelectronics supply chain in the U.S.
“Semiconductors underpin our economic and national security, and they support our Warfighter,” said Senator Todd Young. “We have communicated to the world that we are going to lead in the next era of chip innovation.”
The Microelectronics Commons project solutions are due February 28, 2023 and the official RFS can be accessed here: nstxl.org/opportunity/microelectronics-me-commons.
Grey Ghost Gear and Grey Ghost Precision have announced that they offer OEM services for both soft and hard goods.
Whether you need nylon goods are firearms and accessories, give them a shout.
Made from FR Phase 1 which is one of the lightest most durable FR fabrics on the market, the ling sleeved Lightweight Assaulter Shirt joins the short sleeved version already on the market.
The fabric also features Acclimate Dry Moisture Management to wick sweat away from the body and dry rapidly as well as AG47 Silver Anti-Microbial to fight and eliminate harmful bacteria from your sweat, leaving you odor free.
New Law Will Help Ensure Domestically Manufactured Uniforms and Equipment are provided to Department of Homeland Security Operational Personnel
MARBLEHEAD, Mass., Jan. 09, 2023 — The Warrior Protection and Readiness Coalition (WPRC) commends the inclusion of the “Homeland Procurement Reform Act” in the Fiscal Year 2023 National Defense Authorization Act, recently signed into law by President Joseph Biden. The HOPR Act is the culmination of several years of WPRC advocacy on behalf of the domestic industrial base and American companies that provide 100% made-in- America uniforms, footwear and protective equipment to the Federal government.
This critical, bi-partisan legislation ensures that the operational units within the Department of Homeland Security (DHS) including Customs and Border Protection (CBP), the Transportation Security Administration (TSA), U.S. Secret Service, and Immigration and Customs Enforcement (ICE) procure uniforms and equipment manufactured in the United States. Currently, many DHS agencies purchase uniforms and equipment manufactured in foreign countries that lack supply chain dependability and secure protocols for handling sensitive uniform items. The HOPR Act sets a new precedent to ensure that uniforms, footwear, body armor and equipment for DHS frontline personnel are built in the United States, supporting the industrial base and ensuring supply chain security.
On behalf of their 60+ member companies, the WPRC extends appreciation to primary sponsors Senator Jeanne Shaheen (D-NH), Senator Mike Rounds (R-SD), Rep. Lou Correa (D-CA), and Rep. Brian Mast (R-FL) as well as co-sponsors Sen. Maggie Hassan (D-NH), Sen. Jerry Moran (R-KS), Rep. Chris Pappas (D-NH), and Rep. Jim McGovern (D-MA). HOPR sponsors ensured that this critical legislation was maintained in the FY23 National Defense Authorization Act, and that DHS begins to move towards domestic sources of supply to meet current and future homeland security challenges.
The new law establishes specific criteria that increases the ability of DHS to obtain high-quality, American-made personal protective equipment (PPE) and organizational clothing and individual equipment (OCIE). The HOPR Act builds upon procurement laws such as the Berry Amendment and the Kissell Amendment by expanding opportunities for American manufacturers that meet specific, domestic manufacturing criteria.
WPRC Executive Director David Costello said, “Department of Homeland Security personnel as well as the American public owe a debt of gratitude to the members of Congress who have championed this important legislation. Thanks to their leadership, uniforms, armor, footwear and protective equipment needed by DHS personnel will be supplied by high-quality American sources, improving the quality and performance of this category of products while supporting American jobs. The WPRC looks forward to working with the DHS and the White House to encourage the rapid implementation of this domestic procurement policy.”
In addition to manufacturing the PVC morale patches we guve away at tradeshows, our friends at Flex Systems make other Berry Compliant items like tags and pulls.
flexsystems.com/custom-manufacturing/berry-amendment-parts-and-patches
True Velocity’s Special Patriot Edition includes 20 cartridges of .308 WIN loaded with 168-grain Nosler Custom Competition HPBT projectiles, and each cartridge is emblazoned with the American Flag!
Get yours at tvammostore.com/product/special-patriot-edition-308-win-nosler-hpbt.
1 July 2022
First Breach, Inc. expects to begin manufacturing match-grade components in July, 2022 at its approximately 75,000 sqf facility located in Hagerstown, Maryland, USA. All of First Breach’s components will be made in the USA. Component production will include brass cups, brass casings, full metal jacket (FMJ) projectiles, lead projectile cores, and lead wire. Lead and lead products are smelted from scratch in-house at First Breach’s facility. First Breach will offer its components in a variety of calibers and grains at e-commerce, retail, bulk wholesale, and OEM levels.
First Breach takes great pride in the quality of its US made components. Equipped with numerous quality control checks, First Breach will offer match-grade, SAAMI specification products bar none. Customers will have the ability to order custom head stamped casings as well as a wide range of grain size options for projectiles.
First Breach is happy to extend an invitation to tour our Maryland facility for qualified parties.
For sales & tour inquiries, please contact CJ Dugan, Senior VP of Business Development:
+1 (443) 901-6147
For investor relations, please contact Karl Brenza, CFO:
+1 (914) 374-0060
